fluxing agents which provide a safer and more environmentally friendly
alternative to re-tinning with standard lead bearing compounds. Oxide buildup
and tin depletion on the solder tip can result in longer soldering times,
contaminant transfer and other related problems. Ultrapure Tip Tinner will
replenish the original coating while removing excess oxides from the tip.
Consistent use will aid in extending the useful life span of the tip and reduce
replacement expense. The typically astringent odor often found in products of
this type, has been minimized in this formulation.
Each can comes equipped with a self adhesive pad affixed to the bottom.
Simply remove the backing from the pad and press firmly to any horizontal
surface convenient to the soldering station. This will prevent migration of the
can when in use. Insert the hot solder tip into the compound at approximately
a 45° angle and slowly spin until the entire surface of the tip has been evenly
coated. Any excess metal deposition can be scraped off on the edge of the
can. When the tip is removed from the compound, wipe off any remaining flux
residue on the solder sponge prior to using the tip. Repeat as necessary.